
St Morita Dicing Tape with clear polyolefine film backing and adhesive acrylic, used during the wafer dicing process, cutting of semiconductor material followed by microfabrication "wafer". This tape has a relatively low adhesion, no residual transfer and the ability to stretch the good without tearing the material.
| Product Category | : | Dicing Tape |
| Product Name | : | Dicing Tape PO Blue - Acrylic |
| Adhesive Type | : | acrylic |
| Adhesive Strength | : | 20-30 gF/inch |
| Thickness | : | 50 mic |
| Tensiles | : | 90-100 N/mm2 |
| Elongations | : | 80-100 % |
| Application of tapes | : | Cover, Holding, Backing |